Details about  BGA IC Epoxy Glue Remover Moblie Phone rework reballing

See original listing
BGA IC Epoxy Glue Remover Moblie Phone rework reballing
BGA-IC-Epoxy-Glue-Remover-Moblie-Phone-rework-reballing
Item Ended
Item condition:
Brand New
Ended:
31 Oct, 2012 15:54:24 AEDST
Price:
US $17.80
[
History:
]
 
Approximately AU $23.69(including postage)
Postage:
FREE ePacket delivery from China | See details
Item location:
Shenzhen, Guangdong, China