Details about  Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs...

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Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs...
Design-for-test-and-Test-Optimization-Techniques-for-TSV-based-3D-Stacked-ICs
Item Ended
Item condition:
Brand new
Ended:
09 Sep, 2017 05:16:49 AEST
Price:
AU $160.30
Postage:
Doesn't post to United States | See details
Item location:
Oxford, Oxfordshire, United Kingdom