Enthaltene Kühlkomponente(n)
Keine/Nur Prozessor
Overclocked clock speed (Air)
< span class = notranslate ' > 4.53 GHz
Included Devices
Cooling Fan,Heat Sink
Datasheet
Link
Has virtualization support
Yes
Thermal Specification (T-CASE)
72.6°C
Processor Type
Core i3
Thermal Design Power (Max TDP)
73 W
Sockeltyp
LGA 1156/Sockel H
Supports trusted computing
No
Graphics and IMC Die Size
114 mm 2
L2 cache per core
< span class = notranslate ' > 0.25 MB/core
Recommended Customer Price
BOX : $117.00
Intel® Flexible Display Interface (Intel® FDI)
Yes
Processor Instruction Set
SSE4.2
L3 cache per core
2 MB/core
Intel® Demand Based Switching
No
L1 Cache Size
128KB
Processor Features
Dual-Core
Bus Speed
PC3-8500 (DDR3-1066)
Processing Die Size
81 mm 2
Physical Address Extensions
36 Bit
T CASE
72.6°C
L3 Cache
4MB
Manufacture process
32 nm
Platform Supported
PC
Overclocked clock speed (Water)
3.2 GHz
Form Factor
DIMM
Prozessortyp
Core i3 1. Gen
Process Technology
32 nm
Supports dynamic frequency scaling
Yes
Idle States
Yes
Max Memory Size (dependent on memory type)
16 GB
Transistor Count
< span class = notranslate ' > .000 382.000
L2 Cache
512KB
# of Processing Die Transistors
382 million
of Graphics and IMC Die Transistors
177 million
Low Halogen Options Available
See MDDS
Graphics Controller Model
HD Graphics
Package Type
Intel Boxed
Package Qty.
1
Type
Intel HD Graphics
Release Date
Q1, 2010
NX bit has
Yes
Miscellaneous
64-bit Support
Instruction Set
64-bit
GPU
GPU
Memory Type
DDR3
64-bit Computing
Yes
Thermal Monitoring Technologies
No
Max Memory Bandwidth
21 GB/s
Number of links
1
Serie
Core i3 1. Gen
L3 Cache Size
4096KB
Operating Temperature
Unknown-< span class = notranslate ' > 72.6° C
CPU Series
Intel Core i3, Core i3
Execute Disable Bit ‡
Yes
Architecture
32 Nanometers
Platform Compatibility
PC
64-bit Processing
No
Compatible Port/Slot
1156
Enhanced Intel SpeedStep® Technology
Yes
Processor Quantity
1
Product Type
Processor
Recommended Use
Basic Computing Needs,Digital Home apps,Gaming
RMS Power
73 W
Max CPU Configuration
1
Graphics and IMC Lithography
45 nm
Thermal Design Power
73 W
Processor Frequency (Clock Speed)
2.93 GHz / 2933 MHz
Embedded Options Available
No
PCI Express Configurations ‡
1x16, 2x8
Included Cooling Component(s)
No/Only Processor
PCI Express Revision
2.0
Voltage Range
< span class = notranslate ' > -0.65 < span class = notranslate ' > V 1.4
Overclock popularity
17
Overclocked clock speed
< span class = notranslate ' > 4.53 GHz
Passmark (Overclocked)
< span class = notranslate ' > 2.830 . 2
Is unlocked
No
Max CPUs
1
(Similar) Part Numbers
CM80616003180AG BX80616I3530
Launch Date
Q1'10
DMI
2.5 GT/s
Max # of PCI Express Lanes
16
Clock multiplier
24
threads
4 Threads
VID Voltage Range
0.6500V-1.4000V
Graphics Base Frequency
733 MHz
Level 1 Size
64 KB
GPU Clock Speed
733 MHz
Transfer Rate
< span class = notranslate ' > 2.500 MT/s
(Advanced) Features
EM64T technology Enhanced SpeedStep technology Execute disable bit Extended state maintenance Hyper-Threading technology MMX sse SSE2 SSE3 SSE4 SSSE3 Virtualization technology (VT-x)
Intel® Clear Video HD Technology
Yes
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