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About this product
- DescriptionLead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: Complying with state legislation Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement Implementing cost effective manufacturing and testing Reducing risks due to tin whiskers Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
- Author BiographySANKA GANESAN, PHD, is Associate Research Scientist at the CALCE Electronic Products System Center, University of Maryland. His research interests include advanced materials and interfaces in electronics packages, sensors and MEMS, lead-free electronics, low temperature electronics, and intermittent failures in electronics systems. He has co-authored numerous publications in leading journals and conference proceedings. MICHAEL PECHT, PhD, is Chair Professor, Director, and the founder of the CALCE Electronic Products and Systems Center, University of Maryland. Dr. Pecht is currently Chief Editor of Microelectronics Reliability and has written sixteen books on electronic products development. He has consulted for over fifty major international electronics companies, providing expertise in strategic planning, design, test, IP, and risk assessment of electronic products and systems.
- PublisherJohn Wiley & Sons Inc
- Date of Publication10/03/2006
- SubjectElectronics Engineering & Communications Engineering
- Place of PublicationNew York
- Country of PublicationUnited States
- ImprintJohn Wiley & Sons Inc
- Content Noteillustrations
- Weight1222 g
- Width162 mm
- Height236 mm
- Spine42 mm
- Edited byMichael G. Pecht,Sanka Ganesan
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