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About this product
- DescriptionBackhaul is an important area for today's microwave engineers to focus on with the continuous growth in the mobile device market and the essential function it has in the entire network infrastructure. This timely new resource presents an overview of the electronics of mobile network backhaul. Infrastructure planning, architecture evolution, digital controls, and countermeasures are all presented highlighting the building blocks of specific backhaul features. Tx and Rx design and antenna requirements and covered while examining the overall construction of the microwave radio hardware blocks. Single blocks are explored: the antenna, the analog transmitter and receiver, and the modem, recalling the most important aspects of transport networks and microwave link dimensioning. Essential theory is provided for each hardware block with an emphasis on present solutions. Authored by academic and industrial experts in the field, development and design engineers will benefit from the practical guidance in solving realistic issues and providing useful tips throughout the design process. This book guides readers through the historical evolution of microwave radios and the components of the next generation of mobile networks.
- Author BiographyVittorio Camarchia is an associate professor of electronics with the Electronics and Telecommunication Department, Politecnico di Torino, Turin, Italy. He received the Laurea degree in electronic engineering and his Ph. D. in electronic and communication engineering from Politecnico di Torino, Turin, Italy. Roberto Quaglia is a researcher at the Centere for High Frequency Engineering at Cardiff University. Previously he worked for Huawei Technologies in Milano, Italy as a MMIC designer for millimeter-wave radios. He received the Laurea degree and his Ph. D. from Politecnico di Torino, Turin, Italy. Marco Pirola is an Associate Professor of electronics in the Electronics and Telecommunicaton Department, Politecnico di Tornio, Italy. He received his Ph.D. from Politecnico di Torino, Turin, Italy. He was previously a visiting researcher at the Hewlett Packcard Microwave Technology Division, Santa Rosa, CA.
- PublisherArtech House Publishers
- Date of Publication30/04/2016
- SubjectElectronics Engineering & Communications Engineering
- Place of PublicationNorwood
- Country of PublicationUnited States
- ImprintArtech House Publishers
- Content Noteillustrations
- Weight680 g
- Width157 mm
- Height234 mm
- Spine25 mm
- Edited byMarco Pirola,Roberto Quaglia,Vittorio Camarchia
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