With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of different techlogies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration techlogy, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package techlogies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as I/O (input/output cell) placement and routing for redistribution layer, escape, and substrate. System-in-Package: Electrical and Layout Perspectives is an invaluable reference for EDA researchers, professionals, and graduate students.
Lei He, Shauki Elassaad, Yiyu Shi
now publishers Inc
Date of Publication
Engineering & Technology: Textbooks & Study Guides
Foundations and Trends in Electronic Design Automation