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WIRE BONDING IN MICROELECTRONICS, 3/E by George Harman (Hardcover, 2010)

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Product Information

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The Industry Standard Guide to Wire Bonding--Fully UpdatedThe definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book's full-color figures plus animations.

Product Identifiers

Publisher
Mcgraw-Hill Education-Europe
ISBN-13
9780071476232
eBay Product ID (ePID)
96096410

Product Key Features

Author
George Harman
Publication Name
Wire Bonding in Microelectronics, 3/E
Format
Hardcover
Language
English
Subject
Engineering & Technology
Publication Year
2010
Type
Textbook
Number of Pages
446 Pages

Dimensions

Item Height
239mm
Item Width
163mm
Item Weight
796g

Additional Product Features

Title_Author
George Harman
Country/Region of Manufacture
United States

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WIRE BONDING IN MICROELECTRONICS, 3/E by George Harman (Hardcover, 2010)

About this product

Product Information

Product Identifiers

Product Key Features

Dimensions

Additional Product Features

Best Selling in Adult Learning & University

The Weed Forager's Handbook: A Guide to Edible and Medicinal Weeds in Australia by Adam Grubb, Annie Raser-Rowland (2012, Paperback)

Australian Native Bee Book: Keeping Stingless Bee Hives for Pets, Pollination and Sugarbag Honey by Tim Heard (Paperback, 2015)

The Falsification of History: Our Distorted Reality by John Hamer (Paperback, 2013)

Permaculture: A Designer's Manual by Bill Mollison (Hardcover, 1988)

In-Basket Case Studies by Guy Adamson (Paperback, 1986)

Empire of the Summer Moon: Quanah Parker and the Rise and Fall of the Comanches, the Most Powerful Indian Tribe in American History by S.C. Gwynne (Paperback, 2011)

Botanical Field Guide by Stefan Mager (Fold-out book or chart, 2021)

Save on Adult Learning & University

Netter Atlas of Human Anatomy: Classic Regional Approach

Havard's Nursing Guide to Drugs

Steven Holzner Physics Essentials For Dummies (Paperback)

T. Jared Bunch Matthew LaPlante John D. Day The AFib Cure (Paperback)

NEW The Demon-Haunted World By Carl Sagan Paperback Free Shipping

Care of People with Diabetes: A Manual for Healthcare Practice

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