RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Product Identifiers
Publisher
Springer-Verlag New York Inc.
ISBN-13
9781441909831
eBay Product ID (ePID)
104776215
Product Key Features
Subject Area
Manufacturing Engineering
Author
Franklin Kim, SEAN S. Cahill, Ken Kuang
Publication Name
RF and Microwave Microelectronics Packaging
Format
Hardcover
Language
English
Subject
Engineering & Technology, Physics
Publication Year
2009
Type
Textbook
Number of Pages
285 Pages
Dimensions
Item Height
235mm
Item Width
155mm
Item Weight
1330g
Additional Product Features
Country/Region of Manufacture
United States
Editor
SEAN S. Cahill, Ken Kuang, Franklin Kim
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