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SiP System-In-Package Design and Simulation : Mentor EE Flow Advanced Design Guide by Suny Li (Li Yang) (2017, Hardcover)
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AU $232.94
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Condition:
SiP simulation technology. by Suny Li. Author Suny Li. Table of Contents. Cavity and sacked dies design. FlipChip and RDL design. UK Release Date 2017-09-11. AU Release Date 2017-08-03.
- Buy It NowSiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guid
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About this product
Product Identifiers
PublisherWiley & Sons, Incorporated, John
ISBN-101119045932
ISBN-139781119045939
eBay Product ID (ePID)238206126
Product Key Features
Number of Pages400 Pages
LanguageEnglish
Publication NameSip System-In-Package Design and Simulation : Mentor Ee Flow Advanced Design Guide
SubjectElectronics / Circuits / Integrated, Electronics / Microelectronics, Electronics / Circuits / General
Publication Year2017
TypeTextbook
Subject AreaTechnology & Engineering
AuthorSuny Li (Li Yang)
FormatHardcover
Dimensions
Item Height1.2 in
Item Weight33.7 Oz
Item Length9.8 in
Item Width6.6 in
Additional Product Features
Intended AudienceScholarly & Professional
