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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and
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eBay item number:186387225357
Item specifics
- Condition
- EAN
- 9783319374970
- UPC
- 9783319374970
- ISBN
- 9783319374970
- MPN
- N/A
- Book Title
- Arbitrary Modeling of TSVs for 3D Integrated Circu
- Item Length
- 23.4 cm
- Publication Year
- 2016
- Type
- Textbook
- Format
- Paperback
- Language
- English
- Publication Name
- Arbitrary Modeling of Tsvs for 3d Integrated Circuits
- Item Height
- 235mm
- Publisher
- Springer International Publishing Ag
- Item Width
- 155mm
- Subject
- Engineering & Technology, Computer Science, Physics
- Item Weight
- 2993g
- Number of Pages
- 179 Pages
About this product
Product Information
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Product Identifiers
Publisher
Springer International Publishing Ag
ISBN-13
9783319374970
eBay Product ID (ePID)
226325876
Product Key Features
Publication Name
Arbitrary Modeling of Tsvs for 3d Integrated Circuits
Format
Paperback
Language
English
Subject
Engineering & Technology, Computer Science, Physics
Publication Year
2016
Type
Textbook
Number of Pages
179 Pages
Dimensions
Item Height
235mm
Item Width
155mm
Item Weight
2993g
Additional Product Features
Series Title
Analog Circuits and Signal Processing
Country/Region of Manufacture
Switzerland
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eBay item number:186387225357
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