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About this product
Product Identifiers
PublisherSpringer New York
ISBN-10149391555X
ISBN-139781493915552
eBay Product ID (ePID)209511031
Product Key Features
Number of PagesXvii, 322 Pages
Publication NameWafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications
LanguageEnglish
SubjectIndustrial Design / Packaging, Electronics / Circuits / General, Electronics / General, Mechanics / Thermodynamics
Publication Year2014
TypeTextbook
Subject AreaTechnology & Engineering, Science
AuthorYong Liu, Shichun Qu
FormatHardcover
Dimensions
Item Weight244.9 oz.
Item Length9.3 in
Item Width6.1 in
Additional Product Features
Intended AudienceScholarly & Professional
