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Electrical Modeling and Design for 3D System Integration : 3D Integrated...
US $62.44
ApproximatelyAU $91.91
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Condition:
Good
A book that has been read but is in good condition. Very minimal damage to the cover including scuff marks, but no holes or tears. The dust jacket for hard covers may not be included. Binding has minimal wear. The majority of pages are undamaged with minimal creasing or tearing, minimal pencil underlining of text, no highlighting of text, no writing in margins. No missing pages. See the seller’s listing for full details and description of any imperfections.
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US $4.99 (approx. AU $7.35) USPS Media MailTM.
Located in: Suwanee, Georgia, United States
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Estimated between Fri, 27 Sep and Mon, 30 Sep to 43230
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eBay item number:324306149575
Item specifics
- Condition
- Topic
- Design
- Subject
- Electronics / Circuits / Vlsi & Ulsi, Physics / Electromagnetism
- ISBN
- 9780470623466
- Subject Area
- Technology & Engineering, Science
- Publication Name
- Electrical Modeling and Design for 3D System Integration : 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
- Publisher
- Wiley & Sons, Incorporated, John
- Item Length
- 9.6 in
- Publication Year
- 2012
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Item Height
- 1.2 in
- Item Weight
- 27.7 Oz
- Item Width
- 6.4 in
- Number of Pages
- 384 Pages
About this product
Product Identifiers
Publisher
Wiley & Sons, Incorporated, John
ISBN-10
0470623462
ISBN-13
9780470623466
eBay Product ID (ePID)
99494652
Product Key Features
Number of Pages
384 Pages
Language
English
Publication Name
Electrical Modeling and Design for 3D System Integration : 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Publication Year
2012
Subject
Electronics / Circuits / Vlsi & Ulsi, Physics / Electromagnetism
Type
Textbook
Subject Area
Technology & Engineering, Science
Format
Hardcover
Dimensions
Item Height
1.2 in
Item Weight
27.7 Oz
Item Length
9.6 in
Item Width
6.4 in
Additional Product Features
Intended Audience
Scholarly & Professional
LCCN
2011-028946
Dewey Edition
23
Illustrated
Yes
Dewey Decimal
621.3815
Synopsis
The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques., New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
LC Classification Number
TK7872.M25
Item description from the seller
Seller Feedback (1,377)
- t***h (6)- Feedback left by buyer.Past 6 monthsVerified purchaseLove these books!!! Soo happy!! Thank you! Fast shipping, accurate description, reasonable price!! No marks in any pages and shipped in appropriate packaging to keep book weather protected and safe from damage.
- 8***8 (442)- Feedback left by buyer.Past 6 monthsVerified purchaseItem as described, arrived securely packed, good transaction, would buy from again.
- m***j (229)- Feedback left by buyer.Past monthVerified purchaseFantastic Ebay seller. Calendar was well packaged and arrived in like new condition. Would definitely purchase from this seller again.
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