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Hajimete No Handotai Dry Etching Gijutsu, Paperback by Nojiri, Kazuo, Like Ne...
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eBay item number:364112925955
Item specifics
- Condition
- ISBN
- 9783319356242
- Book Title
- Dry Etching Technology for Semiconductors
- Item Length
- 9.2 in
- Original Language
- Japanese
- Publisher
- Springer International Publishing A&G
- Publication Year
- 2016
- Format
- Trade Paperback
- Language
- English
- Illustrator
- Yes
- Item Height
- 0.3 in
- Genre
- Technology & Engineering, Science
- Topic
- Physics / Condensed Matter, Electronics / Semiconductors, Electronics / Microelectronics, Electronics / Circuits / General
- Item Width
- 6.1 in
- Item Weight
- 74.7 Oz
- Number of Pages
- Xiii, 116 Pages
About this product
Product Information
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc."
Product Identifiers
Publisher
Springer International Publishing A&G
ISBN-10
3319356240
ISBN-13
9783319356242
eBay Product ID (ePID)
239885004
Product Key Features
Book Title
Dry Etching Technology for Semiconductors
Original Language
Japanese
Format
Trade Paperback
Language
English
Topic
Physics / Condensed Matter, Electronics / Semiconductors, Electronics / Microelectronics, Electronics / Circuits / General
Publication Year
2016
Illustrator
Yes
Genre
Technology & Engineering, Science
Number of Pages
Xiii, 116 Pages
Dimensions
Item Length
9.2 in
Item Height
0.3 in
Item Width
6.1 in
Item Weight
74.7 Oz
Additional Product Features
Intended Audience
Trade
Number of Volumes
1 Vol.
Lc Classification Number
Tk7867-7867.5
Reviews
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. , This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc., This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc."
Table of Content
Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.
Copyright Date
2015
Item description from the seller
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eBay item number:364112925955
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