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Photonic Packaging Sourcebook: Fiber-Chip Coupling for Optical Components, Basic

grandeagleretail
  • (921162)
US $145.08
ApproximatelyAU $218.49
Condition:
Brand new
3 available
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Located in: Fairfield, Ohio, United States
Delivery:
Estimated between Tue, 2 Jul and Sat, 13 Jul to 43230
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eBay item number:386717603234
Last updated on 19 May, 2024 21:39:08 AESTView all revisionsView all revisions

Item specifics

Condition
Brand new: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
ISBN-13
9783662521359
Type
NA
Publication Name
NA
ISBN
9783662521359
Book Title
Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Item Length
9.3 in
Publisher
Springer Berlin / Heidelberg
Publication Year
2016
Format
Trade Paperback
Language
English
Illustrator
Yes
Author
Ulrich H. P. Fischer-Hirchert
Genre
Technology & Engineering
Topic
Lasers & Photonics, Industrial Design / Packaging, Nanotechnology & Mems, Telecommunications, Microwaves
Item Width
6.1 in
Item Weight
25.3 Oz
Number of Pages
Xix, 325 Pages

About this product

Product Information

Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.

Product Identifiers

Publisher
Springer Berlin / Heidelberg
ISBN-10
3662521350
ISBN-13
9783662521359
eBay Product ID (ePID)
239640973

Product Key Features

Book Title
Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author
Ulrich H. P. Fischer-Hirchert
Format
Trade Paperback
Language
English
Topic
Lasers & Photonics, Industrial Design / Packaging, Nanotechnology & Mems, Telecommunications, Microwaves
Publication Year
2016
Illustrator
Yes
Genre
Technology & Engineering
Number of Pages
Xix, 325 Pages

Dimensions

Item Length
9.3 in
Item Width
6.1 in
Item Weight
25.3 Oz

Additional Product Features

Number of Volumes
1 Vol.
Lc Classification Number
Tk5101-5105.9
Table of Content
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.
Copyright Date
2015

Item description from the seller

grandeagleretail

grandeagleretail

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