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Recent Progress in Lead-Free Solder Technology: Materials Development, Processin
US $218.31
ApproximatelyAU $330.32
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3 available
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Located in: Fairfield, Ohio, United States
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Estimated between Tue, 2 Jul and Sat, 13 Jul to 43230
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eBay item number:395364668581
Item specifics
- Condition
- ISBN-13
- 9783030934439
- Type
- NA
- Publication Name
- NA
- ISBN
- 9783030934439
- Book Title
- Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances
- Book Series
- Topics in Mining, Metallurgy and Materials Engineering Ser.
- Item Length
- 9.3 in
- Publisher
- Springer International Publishing A&G
- Publication Year
- 2023
- Format
- Trade Paperback
- Language
- English
- Illustrator
- Yes
- Genre
- Technology & Engineering
- Topic
- Materials Science / Metals & Alloys, Manufacturing
- Item Width
- 6.1 in
- Item Weight
- 18.4 Oz
- Number of Pages
- Xii, 328 Pages
About this product
Product Information
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Product Identifiers
Publisher
Springer International Publishing A&G
ISBN-10
3030934438
ISBN-13
9783030934439
eBay Product ID (ePID)
12059002482
Product Key Features
Book Title
Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances
Format
Trade Paperback
Language
English
Topic
Materials Science / Metals & Alloys, Manufacturing
Publication Year
2023
Book Series
Topics in Mining, Metallurgy and Materials Engineering Ser.
Illustrator
Yes
Genre
Technology & Engineering
Number of Pages
Xii, 328 Pages
Dimensions
Item Length
9.3 in
Item Width
6.1 in
Item Weight
18.4 Oz
Additional Product Features
Number of Volumes
1 Vol.
Lc Classification Number
Ta459-492
Table of Content
Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder.- Development of Geopolymer Ceramic Reinforced Solder.- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders.- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process.- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics.- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste.- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi.- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental.- Flux Modification for Wettability and Reliability Improvement in Solder Joints.- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints.- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements.- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth.- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering.- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations.- Tin Whiskers Growth in Electronic Assemblies
Copyright Date
2022
Dewey Decimal
671.56
Dewey Edition
23
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:395364668581
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Item location:
Fairfield, Ohio, United States
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Great seller with great communication! Item arrived complete, as described and for a good price. There was a bit of an issue with tracking the order at one point (not the seller's fault), but seller was proactive in reaching out to the carrier and myself to get everything back on track. Arrived when expected.
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