About this product

Product Identifiers

PublisherCRC Press LLC

ISBN-100849335574

ISBN-139780849335570

eBay Product ID (ePID)48066622

Product Key Features

Number of Pages456 Pages

LanguageEnglish

Publication NameCeramic Interconnect Technology Handbook

Publication Year2007

SubjectMaterials Science / General, Industrial Design / Packaging, Electronics / Microelectronics, Electronics / General, Materials Science / Electronic Materials

TypeTextbook

AuthorFred D. Barlow III

Subject AreaTechnology & Engineering

FormatHardcover

Dimensions

Item Height1.3 in

Item Weight27.3 Oz

Item Length9.5 in

Item Width6.3 in

Additional Product Features

Intended AudienceScholarly & Professional

LCCN2006-024037

IllustratedYes

Dewey Decimal621.381046

Table Of ContentOVERVIEW OF CERAMIC INTERCONNECT TECHNOLOGY; Aicha Elshabini, Gangqiang Wang, and Dan Amey Ceramics in Electronic Packaging Electrical Properties of Ceramic Substrates Mechanical and Physical Properties of Ceramic Substrates Design Rules Thick Films on Ceramics Thin Films on Ceramics High-Current Substrates Applications References ELECTRICAL DESIGN, SIMULATION, AND TESTING; Daniel I. Amey and Kuldeep Saxena Introduction Electrical Properties Electrical Design Considerations Electrical and Thermal Design Considerations Testing and Characterization Summary References THERMOMECHANICAL DESIGN; Al Krum Introduction Fundamentals of Heat Transfer Thermal Design Techniques for Lowering Thermal Resistance Mechanical Design Considerations Thermal and Mechanical Simulation Tools Thermal and Mechanical Measurements References CERAMIC MATERIALS; Jerry E. Sergent Introduction Substrate Manufacturing Surface Properties of Ceramics Thermal Properties of Ceramic Materials Mechanical Properties of Ceramic Substrates Electrical Properties of Ceramics Processing of HTCC Substrates Processing of LTCC Substrates Applications References SCREEN PRINTING; Jerry E. Sergent Introduction The Screen The Stencil The Paste Critical Parameters of the Paste The Squeegee The Printing Process Screen Printer Setup and Operation Screen Printer Setup Geometric Effects on Print Thickness Measurement of Print Thickness Printing Considerations and Problems Inspecting Printed Films Glossary of Terms References MULTILAYER CERAMICS; Fred Barlow, Aicha Elshabini, and Arne K. Knudsen Introduction The Multilayer Ceramic Process Design Considerations Cofired Materials Future Trends References PHOTO-DEFINED AND PHOTO-IMAGED FILMS; William J. Nebe and Terry R. Suess Introduction Photo-Imaged Ceramic Processes PhotoPolymerization Photo-Formed Ceramic Compositions, Developed Using Organic Solvents Aqueous Developable Formulation Photocurable Conductive Pastes: Background Other Applications of Photocurable Paste Technology Acknowledgements References COPPER INTERCONNECTS FOR CERAMIC SUBSTRATES AND PACKAGES; Al Krum Introduction: Why Use Copper? Electrical Performance Thermal and Mechanical Properties of Copper Direct Bond Copper (DBC) Active Metal Brazing (AMB) Thick-Film Copper Thin Film Plated Copper References INTEGRATED PASSIVES IN CERAMIC SUBSTRATES; Heiko Thust and Jens Müller Introduction Materials and Technologies for Lumped Elements Design of Lumped Elements Trimming of Lumped Elements Lumped-Element Properties LTCC-Integrated Passive Devices Distributed Elements References INDEX

SynopsisWith their unique electrical and thermal properties, ceramics are ideal for application in a wide variety of electronic systems and products. However, they are relegated either to a single chapter in electronic packaging books or to older, dated treatments. Offering much more than a discourse on the materials science behind these technologies, this book offers comprehensive, up-to-date coverage of all aspects of ceramic interconnect technologies in electronics and electronic packaging. The authors authoritatively discuss trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, the various types of ceramic interconnects and devices, and applications., Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

LC Classification NumberTK7871.15.C4B37 2007