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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and - Picture 1 of 1

Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah, Alaa El-Rouby, Yehea Ismail (Paperback, 2016)

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.