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Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies by Gilbert B Chapman II (Paperback, 2014)

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Demands for improvements in aerospace and automotive energy-efficiency, performance, corrosion resistance, body stiffness and style have increased the use of adhesive bonds to help meet those demands, by providing joining technology that accommodates a wider variety of materials and design options. However, the history of adhesive bond performance clearly indicates the need for a robust method of assuring the existence of the required consistent level of adhesive bond integrity in every bonded region. The Quality Assurance of Adhesive Bonds by Ultrasonic Nondestructive Testing technology put forth in this book meets that need by describing two new, complementary ultrasonic techniques for the evaluation of these bonds, and thus provide improvements over previous methods. The development of a 20 MHz pulse-echo method for nondestructive evaluation of adhesive bonds will accomplish the assessment of bond joints with adhesive as thin as 0.1 mm. This new method advances the state of the art by providing a high-resolution, phase-sensitive procedure that identifies the bond state at each interface of the adhesive with the substrate(s), by the acquisition and analysis of acoustic echoes reflected from interfaces between layers with large acoustic impedance mismatch. Because interface echo amplitudes are marginal when the acoustic impedance of the substrate is close to that of the adhesive, a 25 kHz Lamb wave technique was developed to be employed in such cases, albeit with reduced resolution. Modeling the ultrasonic echoes and Lamb-wave signals was accomplished using mathematical expressions developed from the physics of acoustic transmission, attenuation and reflection in layered media. The models were validated by experimental results from a variety of bond joint materials, geometries and conditions, thereby confirming the validity of the methodology used for extracting interpretations from the phase-sensitive indications, as well as identifying the range and limits of applications. Results from the application of both methodologies to laboratory specimens and to samples from production operations are reported herein, and show that bond-joint integrity can be evaluated effectively over the range of materials and geometries addressed.

Product Identifiers

Publisher
Authorhouse
ISBN-13
9781496925534
eBay Product ID (ePID)
232542110

Product Key Features

Subject Area
Mechanical Engineering
Author
Gilbert B Chapman II
Publication Name
Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
Format
Paperback
Language
English
Subject
Engineering & Technology
Publication Year
2014
Type
Textbook

Dimensions

Item Height
280mm
Item Width
216mm
Item Weight
535g

Additional Product Features

Title_Author
Gilbert B Chapman II

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Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies by Gilbert B Chapman II (Paperback, 2014)

About this product

Product Information

Product Identifiers

Product Key Features

Dimensions

Additional Product Features

Best Selling in Adult Learning & University

Australian Guidebook for Structural Engineers by Lonnie Pack (Paperback, 2019)

Eduqas GCSE (9-1) Religious Studies Route B: Catholic Christianity and Judaism by Deirdre Cleary, Andrew Barron, Joy White, Patrick Harrison (Paperback, 2017)

Time Management by Peter Quarry (Paperback, 1986)

The Ethnic Cleansing of Palestine by Ilan Pappe (Paperback, 2007)

Save on Adult Learning & University

The Australian Native Bee Hive Book: Keeping Stingless Sugarbag OATH Tim Heard

Weed Forager's Handbook: A Guide to Edible and Medicinal Weeds in Australia by A

Netter Atlas of Human Anatomy: Classic Regional Approach

The Indoctrinated Brain: How to Successfully Fend Off the Global Attack on Your

Tuning the A-Series Engine: the Definitive Manual on tuning for Performance or E

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