VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, Portugal by Ricardo A. Reis, Luis Miguel Silveira, Srinivas Devadas (Paperback, 2013)
For over three decades now, silicon capacity has steadily been doubling every year and a half with equally staggering improvements continuously being observed in operating speeds. This increase in capacity has allowed for more complex systems to be built on a single silicon chip. Coupled with this functionality increase, speed improvements have fueled tremendous advancements in computing and have enabled new multi-media applications. Such trends, aimed at integrating higher levels of circuit functionality are tightly related to an emphasis on compactness in consumer electronic products and a widespread growth and interest in wireless communications and products. These trends are expected to persist for some time as technology and design methodologies continue to evolve and the era of Systems on a Chip has definitely come of age. While technology improvements and spiraling silicon capacity allow designers to pack more functions onto a single piece of silicon, they also highlight a pressing challenge for system designers to keep up with such amazing complexity. To handle higher operating speeds and the constraints of portability and connectivity, new circuit techniques have appeared. Intensive research and progress in EDA tools, design methodologies and techniques is required to empower designers with the ability to make efficient use of the potential offered by this increasing silicon capacity and complexity and to enable them to design, test, verify and build such systems.
Product Identifiers
Publisher
Springer-Verlag New York Inc.
ISBN-13
9781475710144
eBay Product ID (ePID)
189592891
Product Key Features
Subject Area
Electrical Engineering
Author
Ricardo A. Reis, Luis Miguel Silveira, Srinivas Devadas
Publication Name
VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI '99) December 1-4, 1999, Lisboa, Portugal
Format
Paperback
Language
English
Subject
Computer Science, Physics
Publication Year
2013
Type
Textbook
Number of Pages
678 Pages
Dimensions
Item Height
235mm
Item Width
155mm
Volume
34
Item Weight
1050g
Additional Product Features
Series Title
Ifip Advances in Information and Communication Technology
Country/Region of Manufacture
United States
Editor
Luis Miguel Silveira, Srinivas Devadas, Ricardo A. Reis